Thermal management and heat dissipation materials for 5G communication devices.
Investigation Report on Thermal Management and Heat Dissipation Materials for 5G Communication Equipment: Trends in Electronic Patent Technology
You can view patent information categorized by the following technologies: - High-frequency circuit boards - TIM (Thermal Interface Material) - Antenna modules - Optical communication - Vehicle communication - Vapor chambers
- Company:データリソース
- Price:100,000 yen-500,000 yen